Further to its announcement in March, NXP Semiconductors’ shareholders today approved the appointment of Kurt Sievers as its chief executive officer. He takes over from Rick Clemmer, who had led the company for 11 years and will remain a strategic advisor.
Since September 2018, Sievers has been the president of NXP, with direct oversight and management of all NXP’s business lines. He joined NXP (then Philips Semiconductors) in 1995, and moved through a series of marketing and sales, product definition and development, strategy and general management positions across a number of market segments. He became a member of the executive management team in 2009 and was instrumental in the definition and implementation of NXP’s high-performance mixed-signal strategy. In 2015, he was influential in the merger of NXP and Freescale Semiconductors, which resulted in creating NXP’s prominent role in automotive semiconductors and secure edge processing.
Commenting on his appointment, Sievers, said, “While we face unprecedented times, I remain confident in our winning strategy to develop and profitably grow market leading and highly differentiated businesses, and continue to foster a culture of innovation and collaboration. I look forward to continuing to work alongside the very best and brightest team and I am committed to ensure the safety and well-being of each and every one of our employees as we weather the pandemic. I could not be prouder of how we have adapted and stayed focused in these times, and I am confident that we will emerge from this stronger, leading NXP into its promising future.”
The company’s chairman, Peter Bonfield, said that Sievers had proven himself exceptionally qualified to lead NXP into its next chapter. “His expertise across business segments, passion for innovation and connections with NXP investors, customers, and employees around the world make Kurt the right leader to continue and build on the company’s successful strategy for years to come.”
The post NXP Shareholders Appoints Kurt Sievers as CEO appeared first on EE Times Asia.
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