Tuesday, June 30, 2020

U.S. Chip Proposals Seek to Revive Domestic Manufacturing

A group of U.S. senators last week proposed yet another bill to revive the domestic chip industry, theAmerican Foundries Act of 2020 (AFA).

This new bipartisan proposal is the second such measure in a month, following the Creating Helpful Incentives to Produce Semiconductors (CHIPS) act, introduced on June 10.

The two initiatives highlight the effort by the U.S. government to localize the electronics supply chain and rebuild the domestic semiconductor industry now that most of the world’s production has shifted to Asia.

The AFA would provide grants to U.S. states to help expand commercial chipmaking facilities while CHIPS would mainly fund projects run by the Pentagon and other government agencies. Funding for the AFA would be approximately $25 billion while CHIPS comes in at about $12 billion.

The proposed bills also follow a separate effort by the administration of U.S. President Donald Trump to attract investment by Taiwan Semiconductor Manufacturing Co. (TSMC) in a new $12 billion chip facility with industry-leading 5nm technology in the state of Arizona.

TSMC has said its project in Arizona would draw additional investment from other companies that are part of its production ecosystem.

While the chip industry started in U.S., the nation is at risk of falling behind in production as countries in Asia, especially China, have made significant investments in chipmaking, Senator Jim Risch (R-Idaho) said in a June 26 press statement. Seventy-eight percent of the world’s advanced chipmaking capacity is located in Asia, the statement said. North America fell behind China for the first time in 2019, according to the statement.

“With the Chinese Communist Party’s continued efforts to dominate the rest of the world’s microelectronics industries through theft and coercion, it is critical that we work swiftly to strengthen domestic production of semiconductors and maintain our strategic competitive edge,” said Senator Risch.

The AFA would prohibit any firms owned, controlled or otherwise influenced by the Chinese government from accessing funds provided by the legislation.

Other sponsors of the AFA are Tom Cotton (R-Arkansas), Chuck Schumer (D-N.Y.), Josh Hawley (R-Missouri), Jack Reed (D-Rhode Island), Kirsten Gillibrand (D-N.Y.), Susan Collins (R-Maine), Angus King (I-Maine) and Doug Jones (D-Alabama).

“Our nation is in an economic crisis,” Gillibrand said in the press statement. “Investing in microelectronics manufacturing and the semiconductor industry will create high-paying manufacturing jobs for hard-working Americans at a time when our country needs it most. Additionally, this bill helps to strengthen our microelectronic domestic supply chain, prioritize American-owned businesses over foreign production, and keep our country safe.”

AFA funding

The AFA would authorize the U.S. Department of Commerce to award $15 billion in grants to states to assist in the construction, expansion, or modernization of semiconductor fabs, as well as assembly, test, advanced packaging, or advanced research and development facilities.

The AFA would also authorize the U.S. Department of Defense to award $5 billion in grants for the creation, expansion, or modernization of one or more commercial fabs or advanced R&D facilities capable of producing secure and specialized chips for defense and intelligence purposes. This funding would likely go to commercial facilities capable of producing secure microelectronics, the statement said.

The AFA would also authorize $5 billion in R&D spending to secure U.S. leadership in microelectronics. It would also require government agencies that receive this funding to develop policies to require domestic production, to the greatest extent possible, for any intellectual property resulting from R&D pursuant to these funds. DARPA (the Defense Advanced Research Projects Agency) would receive $2 billion of the funding.

CHIPS funding

CHIPS for America would earmark at least $12 billion to fund existing Pentagon electronics “resurgence” efforts while spreading $5 billion across other federal agencies for semiconductor R&D. The largest chunk — $5 billion — would fund an IC packaging and assembly institute. That effort also would also create a $500 million investment fund to support a domestic advanced microelectronics packaging ecosystem.

The swirl of activity around chip manufacturing and tightening technology supply chains comes amidst a U.S.-China standoff over semiconductor technology. The campaign includes the use of American export controls to block Chinese access to U.S. advanced IC manufacturing gear. The primary target is telecommunications giant and 5G leader Huawei.

TSMC’s Arizona plan

Prior to the announcement of the AFA and CHIPS proposals, the Trump administration appeared confident that an agreement with TSMC to build a fab in Arizona was imminent.

“TSMC’s plan to build a $12 billion semiconductor facility in Arizona is yet another indication that President Trump’s policy agenda has led to a renaissance in American manufacturing and made the United States the most attractive place in the world to invest,” Commerce Department Secretary Wilbur Ross said in a May 14 statement. “This plan is the result of years of close collaboration among TSMC, the governor of Arizona and his staff, and the administration.”

TSMC still has some reservations. In order for the deal to be finalized, the U.S. federal and state governments would need to provide subsidies to bring TSMC’s production costs in Arizona on a par with its facilities in Taiwan, according to TSMC Chairman Mark Liu.

TSMC has the world’s most advanced 5nm production technology with foundry customers that range from Apple to Xilinx. Samsung of South Korea is in a close race with TSMC to dominate the foundry business and world-leading technology. Their closest competitor is Intel, which has stumbled with its introduction of 10nm technology.

The AFA and CHIPS initiatives would favor chipmakers with headquarters in the U.S. such as Intel, Micron and GlobalFoundries.

Taiwan-based TSMC has one fab in the U.S., WaferTech, in Camas, Washington. The facility was founded in June 1996 as the first dedicated foundry in the United States.

The post U.S. Chip Proposals Seek to Revive Domestic Manufacturing appeared first on EE Times Asia.



from EE Times Asia https://ift.tt/3g6WPlw

LEDs: The Bright Future of Automotive Lighting

Solid-state lighting is an enabling technology in the automotive field which offers new functionalities, greater security, design flexibility, easier integration with control systems and electronics, greater freedom in light design, also allowing each manufacturer to characterize its style and philosophy.

The electronics onboard a vehicle control many functions: some concern the windscreen wiper systems, others the air conditioning system. Power management systems cover not only lighting solutions but also infotainment solutions in order to offer comfort, safe, pleasant driving.

LED technology is constantly renewed through the development of new functions and electronic control systems; modern designing involves not only the source, but also the shape, projection and image of the light itself.

The main reasons for the success of LED technology lie in a cooler colour temperature (typically 5000 K), which gives a more technological and metallic look to the car, in the versatility of its use, which makes it possible to create thin and uniform light guides to further personalise the aesthetics of the vehicle. However, LEDs also offer a greater depth of projection, thanks to the higher light intensity, and consequently, greater safety.

 Power Management

Insensitivity to vibration, long life, high energy efficiency, and the possibility of having a total control on the light source are fundamental factors for LED applications in vehicles. LEDs ease of control also makes them a natural choice for the intelligent lighting system that is able to adapt to the vehicle and environmental conditions. To drive an LED correctly and achieve efficient light output, current control independent of the supply voltage is required.

A better solution for driving LEDs is, therefore, using current control circuits. LEDs generally require a constant current to produce a consistent light output: a LED driver must be able to vary the output voltage to maintain a constant current. The output voltage will depend on many parameters, such as the LED manufacturing process, mold temperature and the number of LEDs in series.

All switching regulators and LED display drivers used in the Automotive industry are AEC-Q100 qualified. MAX20090 is a single channel high brightness LED driver (HB LED) for automotive front-light applications such as high beam, low beam, daytime running light (DRL), direction indicators, fog lights and other LED lights. LMR23610ADDA is a SIMPLE SWITCHER synchronous step-down converter in 8-pin PowerPAD package. It is a 36 V, 1 A synchronous step-down regulator suitable for various applications with a wide input voltage range from 4.5 V to 36 V. Peak current control is used to achieve simple control circuit compensation. NCP3065 is a monolithic switching regulator designed to provide constant current to power high-brightness LEDs. The device has a wide input voltage up to 40 V to allow 12 Vac or 12 V dc operation.

Figure 1: block diagram of MAX20090

LED Solutions

A car headlight is a high-tech lighting device with a very important role in terms of design and safety. LED technology offers completely new solutions, with a lifetime being equal to the life of the vehicle and it consumes about one fifth of energy compared to other solutions providing lower fuel consumption and carbon dioxide emissions.

The concept of interior ambient lighting has become popular in recent years with the monochromatic colour, such as orange, harmonizing the luminance level between the interior of the vehicle and the external environment, thus reducing driver fatigue during night driving.

RGB static lighting, which began in 2010, provides an atmosphere which delights the passengers. This was followed by the demand for dynamic lighting effects for different scenarios, such as the welcome light effect when entering the vehicle and the driver’s warning light during emergency situations, such as pre-collision warning and blind-spot sightings.

The RGB ambient lighting project is complicated and expensive. It requires high investment in measurement equipment for calibration, manufacturing and testing. Designers are always faced with the challenge of varying the mixed colour rendering of RGB LEDs. This is caused by variations in intensity and wavelength within the color and brightness groups, as well as dependence on forward current and temperature.

In this context, DOMINANT offers a solution to this with a new family called seddLED (Smart Embedded Digital Driver LED), a digital LED in the world that combines RGB LEDs, LED drivers and advanced communication link integrated in a single package.

Figure 2: seddLED (Smart Embedded Digital Driver LED)

“From the concept car design we might see that lighting in car seat cushion, roof lighting, full ambient lighting and AR HUD will be the future trend in the car. Car body lighting, car to car or car to pedestrian communication display or signage projection lighting could be soon available. These new trend will soon be realized especially when autonomous vehicles getting more popular, “ said YY Lim, marketing director at DOMINANT.

seddLED3.0 consists of full digital RGB color and brightness control via software and is pre-calibrated to D65 white point with an accuracy within 3 SDCM steps at 1,400mcd. In addition, it offers a 2Mbit/s half-duplex differential control bus, fast refresh rate of 52.5µs per LED (5.25ms per 100 LEDs). Its built-in temperature sensor allows it to perform automatic temperature compensation in real-time and comes with self-diagnostic functions.

The package also provides superior corrosion resistance with Au lead frame and is certified in compliance with the automotive AEC-Q100 and AEC-Q102 standards. seddLED3.0 offers greater design freedom to create different atmospheres in the passenger compartment.

Figure 3: Comparison of the colour range between standard RGB LEDs and A3A-FKG-RGB-1. A3A-FKG-RGB-1 with pre-calibrated True Green & Blue have an excellent and stable colour gamut.

In the market we can find Nichia and Infineon who have created a design for a high definition (HD) lighting device with over 16,000 micro-LEDs for front lighting applications. Unlike current HD solutions, the new device provides high resolution light to the driver’s entire visual field.

Daytime Running Lights represent perhaps the most common use of LED technology in the automotive field: thanks to the versatility of the small size of the sources and the high luminance, LED systems make it possible to create optical solutions that can be easily integrated into car headlamps.

OSRAM is also constantly focused on the automotive sector with LEDriving® lamps for both the interior and exterior of the car, offering a complete range of both projection and signaling. For projection lamps, the HL family (low beam and high beam) and the FL family (fog lamps) are available to match the complete range of signal lamps (SL). LEDriving® HL for low beam and high beam replace H4, H7, H11, HB4 halogen lamps.

The use of close-up multi-chip LED sources and total reflection allow precise cut-offs (clean cut-off between the light and shadow zone) and a marked reduction in diffused light, all to the advantage of depth of illumination and glare reduction.

The most advanced solutions in LED technology for front lighting are based on Matrix LED systems, i.e. dynamic LED arrays capable of providing automatically adaptable depth light, so as to prevent glare from vehicles coming from the opposite direction.

The post LEDs: The Bright Future of Automotive Lighting appeared first on EE Times Asia.



from EE Times Asia https://ift.tt/2VyGePN

Mini LED Supply Chain to Benefit from 1Q21 Release of Apple’s New iPad Pro

As Apple’s upcoming release of products featuring Mini LED backlight generates a growth in Mini LED demand, the company has also stimulated actors in the Mini LED supply chain to increase their production capacities. According to the latest investigations by the LEDinside research division of TrendForce, in 1Q21 Apple is expected to not only release its 12.9-inch, Mini LED backlight-equipped iPad Pro, but also open contract bids for its 14-inch and 16-inch MacBooks.

Apple has currently chosen Taiwanese manufacturers of display-related components to supply its Mini LED backlights, since Taiwanese suppliers have an advantage in new product development given their superior product stability and technological maturity. Both upstream and downstream suppliers are expected to participate in the Mini LED supply chain, including LED chip manufacturer Epistar, testing and sorting OEM FitTech, pick & place and die attach solutions provider Saultech, SMT supplier TSMT, and PCB backplane manufacturer Zhen Ding Tech – all of which serve important roles in the development of new Mini LED backlight displays.

Mini LED backlight displays have high brightness and high contrast ratios, which can reach upwards of 1,000,000:1, compared to the 10,000:1 contrast ratios of current mainstream displays. Furthermore, Mini LED displays are also highly reliable, as they can maintain their proper functioning and deliver a consistent brightness in harsh environments with temperatures between 60 degrees to -10 degrees Celsius. All of these strengths make Mini LED technology especially attractive to branded manufacturers. As such, Apple has incorporated Mini LED backlights as one of its core areas of focus in the company’s future planning process of new display products.

Although Chinese manufacturers currently possess enormous production capacity and cost advantages in the upstream and downstream LED supply chain, Apple has instead chosen to collaborate with Taiwanese manufacturers (which form a more stable supply chain), in an effort to avoid impacts from the China-U.S. trade war. In addition, Taiwan invested in LED R&D significantly earlier than China did, meaning it leads the latter in terms of both technological maturity and patents. These advantages, combined with the ease of procuring raw materials and components, make Taiwanese suppliers more efficient in the development of new technologies.

Apple’s 12.9-inch iPad Pro is expected to spur a wave of demand in the LED supply chain

Apple’s 12.9-inch iPad Pro is expected to feature 10,384 Mini LED chips and achieve high contrast ratio and high color saturation through local dimming; as such, the biggest challenge facing manufacturers in the supply chain remains the demand for low cost and high yield rate, according to TrendForce. From the perspective of LED chips, Epistar remains Apple’s first choice because of its products’ high degree of consistency and excellent cost-performance ratio, as well as its protection of patents. Also, Mini LED backlight technology requires an extremely stringent testing and sorting process for LED chips based on wavelength and specifications; FitTech and Saultech are thus able to become key partners for Epistar due to their cost-to-performance advantage as well.

On the other hand, SMT supplier TSMT is in partnership with K&S, as specified by Apple, to attempt to overcome mass production bottlenecks through their specific high-speed SMT process. For PCB backplanes, Apple has chosen to collaborate with Korean manufacturer YP Electronics and Taiwan-based Zhen Ding Tech, a subsidiary of longtime Apple ODM Hon Hai Precision Industry (better known as Foxconn). Finally, Apple has partnered with Heesung Electronics and LG Display, both Korean manufacturers, to supply its backlight modules and panels. With the release of Apple’s new models, more and more suppliers, such as GIS, Radiant, Sharp, and BOE, are expected to become part of Apple’s supply chain.

The post Mini LED Supply Chain to Benefit from 1Q21 Release of Apple’s New iPad Pro appeared first on EE Times Asia.



from EE Times Asia https://ift.tt/3gb2zuE

Whiskey Lake signage system has four USB 3.1 Gen2 ports

Ibase’s fanless “SI-642-N” runs Ubuntu or Win 10 on an 8th Gen U-series CPU and offers dual 4K displays, 2x GbE, 4x USB 3.1 Gen2, and 3x M.2 slots. We’re having a bit of a “Groundhog Day” moment here as we’re reading the specs of Ibase’s new SI-642-N signage player. The feature set is very […]

from LinuxGizmos.com https://ift.tt/2Vz9cyZ

Should API-restricting licenses qualify as open source?

Two government buildings

In its 2014 Oracle v. Google decision, the United States Court of Appeals for the Federal Circuit held that the method declarations and "structure, sequence, and organization" (SSO) of the Java SE API were protected by copyright.


read more

from Opensource.com https://ift.tt/2Zmqpgj

Summer Camp - SparkFun Style

We know a lot of summer camps, trips and activities are up in the air, if not downright canceled this year. Not to worry - we’ve got some of your typical summer camp activities covered, with an electronics twist. Check out this summer’s activity schedule, and let’s have some fun!

Wooden trail sign with SparkFun Summer Camp and deal dates

Our summer camp schedule includes:

  • E-textiles: Kick your arts and crafts game up a notch by adding lights and sound to your projects - we see that rad patch you’re working on! (If you end up making a sweet summer camp patch, we’d love to see it! Share on social media and tag @sparkfun.)
  • GPS: Hiking and exploring nature can be tricky if you’re somewhere unfamiliar. Learn more about GPS and try making your own system.
  • Robotics: You could play a classic summertime sport or game – or you could build a robot and teach it to play with you (very slow, two-player tag, anyone?)!
  • Machine Learning: Ever tried to memorize the plants, bugs and animals you might meet in your local great outdoors? Maybe it’s time to have machine learning lend you a hand, so you don't learn the difference between poison ivy and Boston ivy the hard way.

Camp will kick off Thursday evening, July 2nd, and end on Friday, July 31, at 11:59 p.m. MDT. Our special summer camp page will be live on Thursday evening, and each week will have activities, projects and information to get you started on the different topics. While we’re at it, each theme will feature some sort of surprise, because who doesn’t love a sale? Check Thursday evenings for the latest surprise! Please note that we will be closed in observance of the July 4th holiday on Friday, July 3rd.

We’d love to see the projects that you create this summer! Please share with us on social media by tagging us on your post.

comments | comment feed



from SparkFun: Commerce Blog https://ift.tt/31rHO9X

Volunteer your Raspberry Pi to IBM’s World Community Grid

IBM’s World Community Grid is working with scientists at Scripps Research on computational experiments to help find potential COVID-19 treatments. Anyone with a Raspberry Pi and an internet connection can help.

Why is finding potential treatments for COVID-19 so important?

Scientists all over the globe are working hard to create a vaccine that could help prevent the spread of COVID-19. However, this process is likely to take many months — or possibly even years.

In the meantime, scientists are also searching for potential treatments for the symptoms of COVID-19. A project called OpenPandemics – COVID-19 is one such effort. The project is led by researchers in the Forli Lab at Scripps Research, who are enlisting the help of World Community Grid volunteers.

What is World Community Grid and how does it work? 

World Community Grid is an IBM social responsibility initiative that supports humanitarian scientific research. 

Image text reads: Accelerate research with no investment of time or money. When you become a World Community Grid volunteer, you donate your device's spare computing power to help scientists solve the world's biggest problems in health and sustainability.

As a World Community Grid volunteer, you download a secure software program to your Raspberry Pi, macOS or Windows computer, or Android device. This software program (called BOINC) is used to run World Community Grid projects, and is compatible with the Raspberry Pi OS and most other operating systems. Then, when your device is not using its full power, it automatically runs a simulated experiment in the background that will help predict the effectiveness of a particular chemical compound as a possible treatment for COVID-19. Finally, your device automatically returns the results of the completed simulation and requests the next simulation.

Over the course of the project, volunteers’ devices will run millions of simulations of small molecules interacting with portions of the virus that causes COVID-19. This is a process known as molecular docking, which is the study of how two or more molecules fit together. When a simulated chemical compound fits, or ‘docks’, with a simulation of part of the virus that causes COVID-19, that interaction may point to a potential treatment for the disease.

An image of a calendar with the text: Get results that matter. As a World Community Grid volunteer, your device does research calculations when it's idle, so just by using it as. you do every dat you can help scientists get results in months instead of decades. With your help, they can identify the most important areas to study in the lab, bringing them one step closer to discoveries that save lives and address global problems.

World Community Grid combines the results from your device along with millions of results from other volunteers all over the world and sends them to the Scripps Research team for analysis. While this process doesn’t happen overnight, it accelerates dramatically what would otherwise take many years, or might even be impossible.

OpenPandemics – COVID-19 is the first World Community Grid project to harness the power of Raspberry Pi devices, but the World Community Grid technical team is already working to make other projects available for Raspberry Pi very soon.

Getting ready for future pandemics

Scientists have learned from past outbreaks that pandemics caused by newly emerging pathogens may become more and more common. That’s why OpenPandemics – COVID-19 was designed to be rapidly deployed to fight future diseases, ideally before they reach a critical stage.

A image of a scientist using a microscope. Text reads: Your device could help search for potential treatments for COVID-19. Scientists are using World Community Grid to accelerate the search for treatments to COVIS-19. The tools and techniques the scientists develop to fight COVID-19 could be used in the future by all researchers to help more quickly find treatments for potential pandemics

To help address future pandemics, researchers need access to swift and effective tools that can be deployed very early, as soon as a threatening disease is identified. So, the researchers behind OpenPandemics – COVID-19 are creating a software infrastructure to streamline the process of finding potential treatments for other diseases. And in keeping with World Community Grid’s open data policy, they will make their findings and these tools freely available to the scientific community. 

Join a global community of science supporters

World Community Grid is thrilled to make OpenPandemics – COVID-19 available to everyone who wants to donate computing power from their Raspberry Pi. Every device can play a part in helping the search for COVID-19 treatments. Please join us!

The post Volunteer your Raspberry Pi to IBM’s World Community Grid appeared first on Raspberry Pi.



from Raspberry Pi https://ift.tt/38gdal3

8×8 LED Matrix Interfacing with MAX7219 and Pic Microcontroller

The post 8×8 LED Matrix Interfacing with MAX7219 and Pic Microcontroller appeared first on Microcontrollers Lab.



from Microcontrollers Lab https://ift.tt/3dJ3vEL

8×8 LED Matrix Interfacing with MAX7219 and Pic Microcontroller

The post 8×8 LED Matrix Interfacing with MAX7219 and Pic Microcontroller appeared first on Microcontrollers Lab.



from Microcontrollers Lab https://ift.tt/3dJ3vEL

Conversational AI Can Help Communications Scale Up Tremendously

There is a growing use of cloud communication due to the ease of remote working, besides high efficiency and reduced complexity through the integration of real-time capabilities in communication. Chaitanya Chokkareddy, chief innovation officer, Ozonetel discusses how cloud communication and artificial intelligence (AI) can revolutionise the traditional approach in businesses, in an exclusive interaction with […]

The post Conversational AI Can Help Communications Scale Up Tremendously appeared first on Electronics For You.



from Electronics For You https://ift.tt/3dPJKeJ

Be a better Scrabble player with a Raspberry Pi High Quality Camera

One of our fave makers, Wayne from Devscover, got a bit sick of losing at Scrabble (and his girlfriend was likely raging at being stuck in lockdown with a lesser opponent). So he came up with a Raspberry Pi–powered solution!

Using a Raspberry Pi High Quality Camera and a bit of Python, you can quickly figure out the highest-scoring word your available Scrabble tiles allow you to play.

Hardware

  • Raspberry Pi 3B
  • Compatible touchscreen
  • Raspberry Pi High Quality Camera
  • Power supply for the touchscreen and Raspberry Pi
  • Scrabble board

You don’t have to use a Raspberry Pi 3B, but you do need a model that has both display and camera ports. Wayne also chose to use an official Raspberry Pi Touch Display because it can power the computer, but any screen that can talk to your Raspberry Pi should be fine.

Software

Firstly, the build takes a photo of your Scrabble tiles using raspistill.

Next, a Python script processes the image of your tiles and then relays the highest-scoring word you can play to your touchscreen.

The key bit of code here is twl, a Python script that contains every possible word you can play in Scrabble.

From 4.00 minutes into his build video, Wayne walks you through what each bit of code does and how he made it work for this project, including how he installed and used the Scrabble dictionary.

Fellow Scrabble-strugglers have suggested sneaky upgrades in the comments of Wayne’s YouTube video, such having the build relay answers to a more discreet smart watch.

No word yet on how the setup deals with the blank Scrabble tiles; those things are like gold dust.

In case you haven’t met the Raspberry Pi High Quality Camera yet, Wayne also did this brilliant unboxing and tutorial video for our newest piece of hardware.

And for more projects from Devscover, check out this great Amazon price tracker using a Raspberry Pi Zero W, and make sure to subscribe to the channel for more content.

The post Be a better Scrabble player with a Raspberry Pi High Quality Camera appeared first on Raspberry Pi.



from Raspberry Pi Blog – Raspberry Pi https://ift.tt/2CL2YFC
https://ift.tt/3geKXOG

Read and write data from anywhere with redirection in the Linux terminal

Hands programming

Redirection of input and output is a natural function of any programming or scripting language. Technically, it happens inherently whenever you interact with a computer. Input gets read from stdin (standard input, usually your keyboard or mouse), output goes to stdout (standard output, a text or data stream), and errors get sent to stderr.


read more

from Opensource.com https://ift.tt/38hnoC2

10 ReactJS tools to boost your web development skills

Woman sitting in front of her computer

Did you know most résumés submitted for jobs get rejected with just a single glance? That's a daunting fact if you are trying to get started in web development, but there are ways to improve what you have to offer prospective employers and clients. For application developers, now is a great time to increase your skills, and open source is the best avenue for professional development. You don't need to attend university to learn new open source skills; all you need is a sense of direction and self-discipline.


read more

from Opensource.com https://ift.tt/3dEBazC

The open organization everyone deserves

Two different business organization charts

Let me share an email I recently received. It meant the world to me:


read more

from Opensource.com https://ift.tt/3eN2rkz

Webinar on Securing Connected Devices: The Key to Future-Proof IoT Deployments

The IoT explosion has put the spotlight on cybersecurity as governments and businesses strive to keep their software and systems safe amidst an increase in cyberattacks. IoT security, on the other hand, has often been overlooked. In fact, most IoT devices lack the basic security features of even a standard home computer system. In this […]

The post Webinar on Securing Connected Devices: The Key to Future-Proof IoT Deployments appeared first on Electronics For You.



from Electronics For You https://ift.tt/2YJp8Ax

CutiePi tablet based on Raspberry Pi CM3+ starts at $169

On Kickstarter: a $169 and up, open source “CutiePi” tablet that runs a Linux- and Qt-based stack on a quad-core, 1.2GHz Raspberry Pi CM3+ Lite. You also get an 8-inch, 1280 x 800 touchsceen, a 5000mAh battery, and USB and micro-HDMI ports. Taiwanese startup CutiePi, Which has been teasing details about its Raspberry Pi Compute […]

from LinuxGizmos.com https://ift.tt/3eLURqC

Whiskey Lake signage player supports dual 4K displays

Axiomtek’s compact, Linux-friendly “DSP501-527” signage player is built around an 8th Gen CPU and supports dual 4K displays with DP++ and HDMI 2.0. Other features include 5x USB, GbE, M.2 M-key for NVMe, and M.2 E- and B-key slots for wireless or Myriad X AI. Axiomtek has launched a fanless, partially ruggedized digital signage player […]

from LinuxGizmos.com https://ift.tt/3dKXxTV

MontaVista adds continuous integration support

MontaVista announced v3.1 of its Carrier Grade eXpress 3.1 embedded Linux distro based on Linux 5.4 LTS and Yocto 3.1 LTS. CGX 3.1 improves support for CI/CD and is more closely aligned with the Yocto Project. MontaVista Software has upgraded its Yocto Project based Carrier Grade eXpress to version 3.1 with a focus on Continuous […]

from LinuxGizmos.com https://ift.tt/2CMrmGR

Monday, June 29, 2020

FPGAs to Replace GPUs in AI Accelerators

AI software startup Mipsology is working with Xilinx to enable FPGAs to replace GPUs in AI accelerator applications using only a single additional command. Mipsology’s “zero effort” software, Zebra, converts GPU code to run on Mipsology’s AI compute engine on an FPGA without any code changes or retraining necessary.

Xilinx announced today that it is shipping Zebra with the latest build of its Alveo U50 cards for the data center. Zebra already supports inference acceleration on other Xilinx boards, including Alveo U200 and Alveo U250.

Xilinx Alveo U50 Card, intended to replace GPUs in AI Acceleration
The latest build of Xilinx’ Alveo U50 data center accelerator card now comes with Mipsology’s Zebra software for conversion of GPU AI code to run on FPGAs (Image: Xilinx)

“The level of acceleration that Zebra brings to our Alveo cards puts CPU and GPU accelerators to shame,” said Ramine Roane, Xilinx’s vice president of marketing. “Combined with Zebra, Alveo U50 meets the flexibility and performance needs of AI workloads and offers high throughput and low latency performance advantages to any deployment.”

Plug-and-play
FPGAs historically were seen as notoriously difficult to program for non-specialists, but Mipsology wants to make FPGAs into a plug-and-play solution that is as easy to use as a CPU or GPU. The idea is to make it as easy as possible to switch from other types of acceleration to FPGA.

“The best way to see [Mipsology] is that we do the software that goes on top of FPGAs to make them transparent in the same way that Nvidia did Cuda CuDNN to make the GPU completely transparent for AI users,” said Mipsology CEO Ludovic Larzul, in an interview with EE Times.

Crucially, this can be done by non-experts, without deep AI expertise or FPGA skills, as no model retraining is needed to transition.

“Ease of use is very important, because when you look at people’s AI projects, they often don’t have access to the AI team who designs the neural network,” Larzul said. “Typically if someone puts in place a system of robots, or a video surveillance system… they have some other teams or other parties developing the neural networks and training them. And once they get [the trained model], they don’t want to change it because they don’t have the expertise.”

Mipsology Zebra Software Stack. Zebra enables FPGAs to replace GPUs
Zebra’s stack. The technology is applicable across data center, edge and embedded applications (Image: Mipsology)

Versus Xilinx
Why would Xilinx support third-party software when it already its own neural network accelerator engine (XDNN)?

“The pitch in one sentence is: we are doing better,” Larzul said. “Another sentence would be: ours works.”

Mipsology has its own compute engine within Zebra, which supports customers’ existing convolutional neural network (CNN) models, unlike XDNN which Larzul said has support for plenty of demos but is less well-suited to custom neural networks. This, he said, made getting custom networks up and running with XDNN “painful”. While XDNN can compete in applications where there is no threat from GPUs, Zebra is intended to enable FPGAs to take on GPUs head-on based on performance, cost and ease of use.

Mipsology Zebra stack in detail - helps FPGAs replace GPUs
Zebra’s stack in detail. The aim is to make FPGAs a simpler switch from GPUs or CPUs for AI acceleration by hiding the hardware as much as possible (Image: Mipsology)

Most customers’ motivation to change from GPU solutions is cost, Larzul said.

“They want to lower the cost of the hardware, but don’t want to have to redesign the neural network,” he said. “There is a non-recurring cost [that’s avoided] because we are able to replace GPUs transparently, and there is no re-training or modification of the neural network.”

FPGAs also offer reliability, in part because they are less aggressive on silicon real estate and often run cooler than other accelerator types including GPUs, according to Larzul. This is especially important in the data center where long-term maintenance costs are significant.

“Total cost of ownership is not just the price of the board,” Larzul said. “There is also the price of making sure the system is up and running.”

Zebra is also aiming to make FPGAs compete on performance. While FPGAs typically offer less TOPS (tera operations per second) than other accelerators, they are able to use those TOPS more efficiently thanks to Zebra’s carefully designed compute engine, Larzul said.

Ludovic Larzul (Image: Mipsology)
Ludovic Larzul (Image: Mipsology)

“That’s something that most of the ASIC start-ups accelerating AI have forgotten — they are doing a very big piece of silicon, trying to pack in more TOPS, but they haven’t thought about how you map your network on that to be efficient,” he said, noting that Zebra’s FPGA-based engine is able to process more images per second than a GPU with 6x the amount of TOPS.

How is this achieved? While Larzul did not give exact details, he did say that they do not rely on pruning, since the accuracy reduction is too great to be acceptable without retraining. They do not use extreme quantisation (below 8-bit) for the same reason.

Zebra’s engine accelerates CNNs, which are mostly used by image and video processing applications today, but Zebra can also be applied to BERT (Google’s natural language processing model), which uses similar mathematical concepts. Future iterations of Zebra may cover other types of neural network including LSTM (long short-term memory) and RNNs (recurrent neural networks), but this is harder to achieve since RNNs are mathematically more diverse.

Team from EVE
Mipsology was founded in 2015, with around 30 people working on R&D in France, and a small team in California mainly covering business development. The company has received funding totalling $7m, $2m of which was a prize from a French government innovation competition in 2019.

Mipsology’s core team is from EVE — an ASIC emulator company acquired by Synopsys in 2012 for its ZeBu (Zero Bug) hardware-assisted verification products, at that time a competitor for Cadence’s Palladium verification platform. According to Larzul, EVE technology was used by almost all the major ASIC companies to verify ASICs during the design cycle; this technology relied on thousands of FPGAs connected together to reproduce ASIC behavior.

Mipsology has 12 patents pending and works closely with Xilinx as well as being compatible with third party accelerator cards such as Western Digital small form factor (SFF U.2) cards and Advantech cards like the Vega-4001.

The post FPGAs to Replace GPUs in AI Accelerators appeared first on EE Times Asia.



from EE Times Asia https://ift.tt/3eJDQNJ

Blog: Will Mercedes-Nvidia Deal Bring ‘Autonomy’?

If I’m terrible at telling jokes, I’m even worse at writing them. Just take a look: How many commas does it take to make a unicorn? Three. See, not even funny. How about this one: Why did the VC investor cross the road? Because their self-driving portfolio had crashed. Okay, I quit.

But I’ve got nothing on Nvidia and Mercedes who just announced plans to develop the most sophisticated and advanced computing architecture ever deployed in an automobile. Wow. You can watch the whole presentation here — don’t forget the popcorn.

With serious faces Nvidia CEO Jensen Huang and Mercedes-Benz Head Ola Källenius talk about “enabling state-of-the-art automated driving functionalities.” This includes — wait for it — “the ability to automate driving of regular routes from address to address.”  Under the agreement, they will develop “autonomously assisted” (sic) vehicle applications that include SAE level 2 and 3, as well as automated parking functions (up to level 4).”

Did you catch the pivot? Privately-owned passenger vehicle autonomy is out, and automated is in. Cars won’t drive themselves anytime soon and the human driver will be liable at all times. The trouble for Nvidia is that for L2 vehicles — or L2+ if we are specifically talking about a hands-free highway assist feature — you don’t need the most sophisticated and advanced computing architecture ever deployed in an automobile. Let’s look at some examples:

  • Both GM Super Cruise in the Cadillac CT6 and the first generation of Tesla’s Autopilot used the Mobileye EyeQ3 chip.
  • Ford’s Active Drive Assist, announced earlier in June, will almost certainly use Mobileye’s EyeQ4 chip for the hands-free function and a Xilinx FPGA for very sophisticated driver monitoring to supervise the driver’s attention state and engagement level.
  • In 2021 BMW looks set to be the first automaker into production with the Mobileye EyeQ5 chip in its iNEXT platform, the first model of which I believe will be the i4.

There is no shortage of design and development work for assisted and automated driving at other semiconductor suppliers beyond Nvidia, such as Infineon, Mobileye (Intel), NXP, Renesas, Texas Instruments, Toshiba and Xilinx, so there is something else at play here beyond a very cleverly crafted and carefully worded press release. Let’s take a look at what is in the partnership for Mercedes and Nvidia and see if it tells us anything.

What’s in it for Mercedes?
In a word: Survival. Here’s a picture I took at the Frankfurt Auto Show in September last year (my photographic skills are about as good as my jokes, but that is another matter).

Mercedes-Nvidia Deal Will Bring 'Autonomy'?
Mercedes-Benz at Frankfurt Auto Show in 2019 (Photo: Colin Barnden)

I walked around that car several times and this is the sensor suite: 6 lidars, 16 cameras, 5 radars and 30 ultrasonic sensors. That’s where Mercedes’ automated driving development was towards the end of last year. Let’s be polite and call it a cul-de-sac.

Making cars is a highly competitive business, so let’s look at developments outside of Stuttgart for some more clues:

  • GM has had Super Cruise in production for almost three years, something rumored to be called “Ultra Cruise” on the way and next generation technology development from Cruise. They clearly like the word Cruise at GM.
  • Ford looks to have a technology agreement with Mobileye, has successfully integrated driver monitoring technology into its driver assistance suite and next-generation technology development from Argo AI, including co-operation with Volkswagen.
  • BMW has a long-term, well-established technology partnership with Intel for both processors and Mobileye chips.

As the pieces of the automated driving puzzle fall into place, Mercedes seems not only to have no obvious technology development program of its own, but it could very well be four years behind the Blue Oval — we’ll know more when Ford launches the latest generation F-150 truck later this week. That’s all pretty humiliating for a premium car maker and supposed technology leader.

What’s in it for Nvidia?
“Those who cannot learn from history are doomed to repeat it”

We are now witnessing the commoditization of automated driving, and Nvidia just scalped Mercedes. Well played, Jensen. As a tech analyst I’ve seen this scenario play out many times before: PCs, smartphones, cameras, DVD players, to name a few. Standards settle, functionality is fixed and then it just becomes a race to the bottom.


Recommended

Mercedes Ends BMW Partnership, Elopes with Nvidia


Nvidia is supplying Mercedes with the Orin chip and the automated driving software. What is Mercedes bringing to the party, other than its good name and reputation? Nvidia’s strategy is already focused on China and the announcement says nothing about Mercedes exclusivity. Next stage, Nvidia licenses the technology to every Chinese new energy vehicle (NEV) maker.

What do we have here? It’s the IBM PC all over again, and history tells us what happened to the box maker (IBM), the processor supplier (Intel) and the software supplier (Microsoft); and it’s smartphones all over again and history tells us the winners were the chip suppliers (Apple, Qualcomm, Samsung) and the software suppliers (Apple and Google).

For both PCs and smartphones, the winning box makers were all Chinese OEMs, such as Foxconn, Huawei and Lenovo. Does anyone even care what happened to Blackberry, Motorola or Nokia?

Sucker punch
This is a story about Elon Musk. He quickly dropped two innovation bombs on the automotive world, first with electrification of the powertrain, then with Autopilot. We can now see which premium automaker was so bamboozled by the pace of technological development that they crashed the car.

Mercedes, now possibly four years behind Ford, just bet the house on a partnership with Nvidia and a chip not yet even in production or automotive qualified. What could possibly go wrong? Well the EU General Safety Regulations fully come into effect in 2024 — the year Mercedes plan for the new system to enter production — and it is now not clear what value-add Mercedes can offer over Chinese NEV makers using the same Nvidia platform.

In poker, if you can’t figure who the sucker is, the sucker is you. So, the joke is on you, Ola, and I thought my jokes were bad. And what is an “autonomously assisted” vehicle anyway, Jensen?

The post Blog: Will Mercedes-Nvidia Deal Bring ‘Autonomy’? appeared first on EE Times Asia.



from EE Times Asia https://ift.tt/3eVnDF2

Low-Power Design Approaches along with IP Solutions

A. Abstract:

Power reduction methods for Integrated circuit design, especially for the battery driven mobile devices, such as tablets, mobile phones, wearable devices, IoT devices etc., are crucial for the future electronic products.

Power consumption becomes increasingly important for electronic system. In view of this, IC developers focus on ultra low power design by reducing dynamic and static power consumption.

B. Approaches of reducing both static and dynamic power consumption.

  • Adopt low-power/low-leakage wafer process technologies
  • Reduce operating voltage
  • Clock Gating approach
  • Power Gating approach
  • Multiple Voltage and Frequency Domains
  • State Retention Power Gating strategy

(A) Adopt low-power/low leakage wafer process technologies

Wafer fabs offer Low-Power (LP) and Low-Leakage (LL) processes with LP and LL devices. Adoption of LP and/or LL transistors is able to reduce circuit’s power consumption straightly. For example, TSMC 22ULL, 40ULP, 55ULP, etc.

(B) Reduce operating voltage

Power= Voltage x Current, lowering operating voltage reduces power dissipation directly. However, consideration of design and process variation is required.

(C) Clock Gating approach

Clock gating approach saves power by adding additional logic cells in the design to optimize the clock tree structure. In general, a clock signal connects to many flip flops, lots of the flip flops retain previous clock value. Switching off the clock signal to these flip flops which still retain previous values results in less toggling of the clock path, thus saves dynamic power.

Clock Gating Cell

(D) Power Gating approach

Power Gating approach is a way of power reduction by shutting off the current to the circuitries that are not in use. Some circuitries in a chip design are not always actively used. Turning off the power of these circuitries enables lots of saving of static (leakage) power and some dynamic power, even clock is switched off.

 

 

(a) ISO cell (b) RISO cells, act like a buffer with enable.

(E) Multiple Voltage and Frequency Domains

Multiple voltage and frequency domains also can save power. For a high-performance design circuitry, it requires higher voltage supplies to generate high frequencies. Once the signal reduces frequencies, it then no more need for high voltages. When the signals cross the different voltage domains, a level shifter can be used to reduce the total power.

Illustration of Level Shifter between Power Domains

(F) State Retention Power Gating approach

For register data that may get lost in power gating requires a “power-on-reset”.

While the circuitry stays at stand-by mode, State Retention Power Gating can trade off power dissipation to retain some registers’ state values in exchange of more efficient wake-up and operates at a known state.

Header cell and retention flip-flop, integration of the header cell and the retention flip-flop

C. Comprehensive Low-Power IP Portfolio

M31’s IP portfolio for low-power design include SRAM, Standard Cell Library, Analog IP, and USB PHY is described below

(A) SRAM

Leverage Monte Carlo Method to perform simulations. Provide analysis on SRAM by following wafer fabs’ process technologies. Identify the electrical characteristics and distributions that affect SRAM’s quality and yield. These will get optimized design solutions.

  1. Power Gating SRAM: provides low-power modes which include stand-by, nap, retention, and power shutdown.
  2. Dual Rail SRAM: dual power domains, VCCP for peripheral and VCCA for cell array
  3. Low-VCCmin SRAM: supports low voltage operation to reduce power leakage and dynamic power consumption with SRAM cell stability enhancement and read/write assist circuitries.

(B) Standard Cell Library

  1. Low-Power Standard Cell Library provides basic logic gates that are required for low-power SoC design.

i. Power management kit contains

    • Power gating cells
    • Level shifters
    • Isolation cells
    • Always-on cells
    • Retention flip-flops

ii. Low Power Optimization Kit contains

    • Multi-Bit Flip-Flop (MBFF): 2-bit and 4-bit flip flops. Each type has a DFF and Scan-FF version with set/reset function
    • Small input capacitance cells: reduce the device size of flip-flop’s CK pin to save clock tree switching power
    • Fine-grain cells: provide more options of driving strength, select the most proper cells for different loading conditions, to optimize power consumption

iii. Low dynamic power strategy

    • Shorter routing trace with less parasitic capacitance
    • Ultra-Low internal supply voltage

With implementation of low-power cell library solutions, the total power of the design block can be reduced by around 10%.

  1. Thick Gate Oxide (TGO) standard cell library uses I/O TGO devices with thicker gate-oxide and larger channel-length than regular core device. This approach dramatically reduces leakage current. For a non-critical design block, The TGO standard cell library can be applied on “always-on” power domain. It will effectively minimize leakage current. TGO library can save about 70% total power in comparison with regular thin-gate oxide library under the same operating frequency and voltage.

iv. Ultra-Low leakage Library contains

    • Ultra-low leakage devices design with thick-gate library
    • Level Shifter, wide-range voltage support between core and IO

This figure shows a benchmark data by targeting TSMC 40ULP process node. It shows that M31 TGO cell library reduces 70% power dissipation in comparison with core device cell library under low operation frequency (below 1MHz).

(C) Analog IP

  1. Data Converters with Ultra Lower Power (ULP) and High Performance

To get an IC design with better Power (P), Performance (P) and Area (A), M31 proposes the “Modular IP” concept in designing data converters (ADCs/DACs) and analog-frond-ends (AFEs).

i. ULP ADCs/AFEs

ULP ADCs are designed with high configurability so that they are capable of retrieving both kinds of input signal: voltage or current sent by the transducer or the very first front-ends. For specific application, some ADCs feature built-in (or inherent) anti-aliasing filters as well as programmable gain adjustments (PGA) to relax the design effort of preceding stages. Highlighted features are:

    • Flexible input source type: voltage or current
    • Wide applications ranging from low-speed, high resolution to medium-to-high speed, moderate resolution
    • LP (micro Watt) to ULP (nano Watt) power consumption and scalable to clock rate

ii. High Performance Data Converters

As the data rate and signal bandwidth continue to be increased toward GHz or MHz, the operating clock/bandwidth of the data converters must be capable of handling massive amounts of data. To achieve such requirement, M31 proposes advanced data converter architectures including Continuous-Time (CT), Discrete-Time (DT) or Hybrid Delta-Sigma ADCs/DACs with the following applications::

    • Wireless/Wireline communications: WiFi, 2G/3G/4G/LTE-A/5G
    • Automotive: Radar/Lidar AFEs
    • Audio / Instrumentation or Measurement

  1. PVT Sensor

Lowering supply voltage is a quick and easy solution to reduce power consumption; however, it requires to implement variation-aware technique, such as PVT sensors, to prevent failure since transistors are sensitive to process (P), voltage (V), and temperature (T) under low voltage operation. Therefore, M31 proposes PVT sensors with medium-to-high performance and ultra-low power (ULP). Furthermore, by integrating analog interface (TIA, PGA, and Filter, etc.) as well as ADC (“Modular ADC” based design), these PVT sensors become smart. Also, PVT sensor IPs assist in accelerating time-to-market of feature-rich SoC design.

  1. Phase Lock Loop

Ultra-Low Power Fractional PLL is a general purpose frequency synthesizer with input reference frequency range from 10 to 240 MHz and 3:1 output frequency range. The PLL IP is a typical Type-II PLL. The fractional part of the output frequency is achieved by using a programmable 3rd-ord sigma delta modulator. The PLL IP operates on core supply voltage with embedded LDO for excellent supply rejection in noisy SoC applications. It is designed with easy usage and simple integration without complex configurations. Furthermore, this IP offers a reliable clock source for SoC that operates under a very low voltage(0.7V)to save power.

(D) USB PHY

M31 has the worldwide smallest Low-Power USB PHY 2.0 that targets portable devices    and IoT applications. It reduces more than 30% operating current and 70% stand-by current. M31 offers a next generation USB 2.0 IP which delivers an extremely smaller die area and lower active and suspend power consumption. M31 leverages a new design architecture to implement USB 2.0 IP without sacrificing USB 2.0 performance. The USB 2.0 IP is not only suitable for USB peripherals but also is an optimized solution for SOC with multiple USB ports.

In addition, M31’s Crystal Free Technology allows USB PHY to operate without external crystal oscillator nor input reference clock. It is named as BCK (Built-in-Clock) USB PHY. This BCK USB performs background calibration during USB data transfer to ensure the internal clock frequency accuracy. The IP meets IF-compliance specification and it performs same electrical characteristics and low power as the standard USB PHY.

 

Eye Diagram of USB 2.0 PHY

D. Availability

A Table of Availability in summary is provided as below. Please refer to the latest M31’s IP catalog for more details.

M31 USA Office

1900 McCarthy Blvd., Suite 105,

Milpitas, CA 95035

Tel: +1.408.780.2779

Contact Information

M31 Technology Corporation

14F, No.1, Taiyuan 1st St., Zhubei City,

Hsinchu County 30265, Taiwan

Tel: +886.3.5601866

Sales

USA: US-sales@m31tech.com

Website: https://www.m31tech.com

About M31 Technology

M31 Technology Corporation is a professional Silicon Intellectual Property (IP) provider. The company was founded in October, 2011 with its headquarters in Hsinchu, Taiwan. M31’s strengths are its outstanding R&D capability and customer services. With substantial experiences in IP development, IC design, and design automation fields, M31 focuses on providing High-speed Interface IP such as SerDes, USB, PCIe, MIPI, SATA, and Foundation IP such as Standard Cell Library, Memory Compiler, and ESD/IO Library solutions. The vision of M31 is being the most trustworthy IP provider in semiconductor industry. For more information please visit https://www.m31tech.com

The post Low-Power Design Approaches along with IP Solutions appeared first on EE Times Asia.



from EE Times Asia https://ift.tt/2ZiU1uV

Nathan Seidle on IoT Radar

We're popping in today to bring your attention to our LinkedIn page, where you can see Nathan talk about machine learning, artificial intelligence, tinyML, data logging with the Artemis OpenLog, and the origins of SparkFun with Wisse Hettinga at the IoT Radar.

Nate & Wisse

It's a fun interview, and you'll get a glimpse of some projects Nathan is working on at home! The interview is only up until July 3rd, so there are only a few days left to watch it.

comments | comment feed



from SparkFun: Commerce Blog https://ift.tt/38a4nkM

Be a better Scrabble player with a Raspberry Pi High Quality Camera

One of our fave makers, Wayne from Devscover, got a bit sick of losing at Scrabble (and his girlfriend was likely raging at being stuck in lockdown with a lesser opponent). So he came up with a Raspberry Pi–powered solution!

Using a Raspberry Pi High Quality Camera and a bit of Python, you can quickly figure out the highest-scoring word your available Scrabble tiles allow you to play.

Hardware

  • Raspberry Pi 3B
  • Compatible touchscreen
  • Raspberry Pi High Quality Camera
  • Power supply for the touchscreen and Raspberry Pi
  • Scrabble board

You don’t have to use a Raspberry Pi 3B, but you do need a model that has both display and camera ports. Wayne also chose to use an official Raspberry Pi Touch Display because it can power the computer, but any screen that can talk to your Raspberry Pi should be fine.

Software

Firstly, the build takes a photo of your Scrabble tiles using raspistill.

Next, a Python script processes the image of your tiles and then relays the highest-scoring word you can play to your touchscreen.

The key bit of code here is twl, a Python script that contains every possible word you can play in Scrabble.

From 4.00 minutes into his build video, Wayne walks you through what each bit of code does and how he made it work for this project, including how he installed and used the Scrabble dictionary.

Fellow Scrabble-strugglers have suggested sneaky upgrades in the comments of Wayne’s YouTube video, such having the build relay answers to a more discreet smart watch.

No word yet on how the setup deals with the blank Scrabble tiles; those things are like gold dust.

In case you haven’t met the Raspberry Pi High Quality Camera yet, Wayne also did this brilliant unboxing and tutorial video for our newest piece of hardware.

And for more projects from Devscover, check out this great Amazon price tracker using a Raspberry Pi Zero W, and make sure to subscribe to the channel for more content.

The post Be a better Scrabble player with a Raspberry Pi High Quality Camera appeared first on Raspberry Pi.



from Raspberry Pi https://ift.tt/2CL2YFC

Solar Energy And EV Charging Infrastructure

e-Mobility and electric vehicle (EV) charging infrastructure are some of the key focus areas, and relentless research is being done to address high performance in all functional blocks. With the push to move to electric mobility at a national scale, and with the government being very enthusiastic about deployment of electric vehicles (EVs), the electronics […]

The post Solar Energy And EV Charging Infrastructure appeared first on Electronics For You.



from Electronics For You https://ift.tt/2NDf4TF

Single Platform For Simplifying Automation Of Robotic Systems

OnRobot’s robotic tools facilitates flawless collaboration with industrial robots Two of its revolutionary products, OnRobot Screwdriver and the Gecko Single Pad gripper allow ease in flow of processes Denmark-based OnRobot, a provider of robotic tools for collaborative applications is introducing its One System Solution in India. This system enables seamless integration of OnRobot’s products with […]

The post Single Platform For Simplifying Automation Of Robotic Systems appeared first on Electronics For You.



from Electronics For You https://ift.tt/3g6PORD

Chip manufacturer invites to a virtual tour

Trade shows are an essential part of communication with customers – this is where new technologies and innovative products are launched. As a result of the coronavirus, numerous trade fairs had to be cancelled or postponed since spring 2020. In the short term, Infineon Technologies AG is therefore strengthening its own activities in the digitalization of sales and marketing activities. The semiconductor manufacturer is thus presenting two important trade show highlights on the internet in July: power semiconductors and sensors.

Infineon’s virtual PCIM 2020 booth with the latest power semiconductors will be completely online as of 1 July. Already today, a preview with short descriptions of the demos is accessible. And the Virtual Sensor Experience (VSE) booth with sensor topics can be visited on the internet starting 20 July. Both online experiences are similarly designed: after the registration required by data protection law, the user can explore the booth with the respective main topics on his or her own. At PCIM, these are industry, consumers and solutions for transport and e-mobility. At VSE, the focus is on automotive, industry and consumers, the latter once again divided into smart building and lifestyle.

Visitors to both internet trade shows have the opportunity to obtain information about products in real time via webinars: there are 17 presentations at the virtual PCIM booth, at the VSE booth up to ten. All presenters are also available for questions via a chat function afterwards. The extensive program of product presentations will run from 1 to 3 July (PCIM) and 20 to 22 June (VSE).

Three main topics, 25 demonstrators, more than 100 products: this year, Infineon will run PCIM 2020 completely virtually. As usual, visitors will again get a comprehensive insight into product innovations and application solutions. With the broadest portfolio of power semiconductors, including silicon, silicon carbide (CoolSiC™) and gallium nitride (CoolGaN) technologies, Infineon continues to set standards. The online trade show will open its doors with all product information available on 1 July. The highlight products are:

  • Hydrogen sulfide (H2S) leads to the growth of copper-sulfide crystalline in power semiconductors, which has a major impact on the lifetime of IGBT modules. To prevent premature failure, Infineon has developed H2S protection. EconoPACK™+ modules with a TRENCHSTOP™ IGBT4 chipset are the first in the Econo portfolio to feature this new protection.
  • 650 V, 1200 V, 1700 V: Now, the 1200 V 62 mm module is being launched. This proven package type with baseplate opens up silicon carbide for applications in the medium power range starting at 250 kW – where silicon reaches the limits of power density with IGBT technology.
  • In the drivetrain of electric cars, Infineon will give an outlook on future power modules with CoolSiC MOSFET technology. Among other things the chipmaker will showcase the HybridPACK Drive CoolSiC, a 1200 V full bridge module for traction inverters.
  • Infineon offers a wide range of products for Battery Management Systems (BMS) consisting of safety controllers, sensors, circuit breakers, supply and security components. The company now introduces a BMS IC with precise voltage measurement, high robustness against interference and integrated cell balancing.

In addition to these highlight products, a variety of other application solutions will be on display at Infineon’s virtual PCIM booth. These include for example the 2300 V PrimePACK 3+ for 1500 V central inverters in the solar sector and the 1600 A PrimePACK 2 for motors of up to 400 kW. The new TRENCHSTOP IGBT7 technology for the 650 and 1200 V voltage classes will also be presented. A special section will map the existing CoolSiC portfolio.

The post Chip manufacturer invites to a virtual tour appeared first on EE Times Asia.



from EE Times Asia https://ift.tt/2Zkm257

Sensing and Balancing IC for Automotive Battery Management System

Infineon’s new BMS IC maintains longevity of batteries in hybrid and electric cars It also lessens the disruptions caused by interfering signals on the measurement results Battery management systems (BMS) ensure that the capacity of a battery is optimally utilized so that the longest possible range is achieved by an electric car and that the […]

The post Sensing and Balancing IC for Automotive Battery Management System appeared first on Electronics For You.



from Electronics For You https://ift.tt/2Ad6AiV

MCU Offers Low Power Consumption and Small Size for IoT Applications

Maxim Integrated’s new Arm Cortex-M4-based MCU provides reliable operation uninterrupted by bit flips Also allows developers to offer a low-power solution Maxim Integrated has launched the MAX32670, a low-power Arm Cortex-M4 microcontroller (MCU) with floating-point unit. The device protects all embedded memory for both flash and SRAM with error-code correction (ECC) to provide the highest […]

The post MCU Offers Low Power Consumption and Small Size for IoT Applications appeared first on Electronics For You.



from Electronics For You https://ift.tt/3gbqjin

Using Bash traps in your scripts

Hands programming

It's easy to detect when a shell script starts, but it's not always easy to know when it stops. A script might end normally, just as its author intends it to end, but it could also fail due to an unexpected fatal error. Sometimes it's beneficial to preserve the remnants of whatever was in progress when a script failed, and other times it's inconvenient. Either way, detecting the end of a script and reacting to it in some pre-calculated manner is why the Bash trap directive exists.


read more

from Opensource.com https://ift.tt/2NG1yOS

A minimalist Mac terminal for Linux fans

Coffee and laptop

I have a confession to make: I have been a Mac user for more than 10 years now. At first, I felt a little shame, given my strong Linux background, but the Mac gives me a Unix-like shell and a great window manager. Because of that history, I have a mix of features that will run on macOS but feel familiar to Linux users. There's no reason it can't port over to Linux (and it has!).


read more

from Opensource.com https://ift.tt/3dJo1Fg

How I channel my inner Star Trek character at work

In a recent Twitter thread , I self-identified as "some days Deanna, some days Riker." Others shared their own "Star Trek Sp...